Key research themes
1. How do gate and channel engineering techniques mitigate short-channel effects and enhance performance in multigate MOSFETs?
This research theme focuses on advanced structural modifications such as gate engineering (using dual or tri-material gates) and channel engineering (graded/asymmetric doping) in multigate MOSFET architectures to reduce short-channel effects (SCEs), suppress leakage and hot-carrier effects (HCE), and improve analog/RF and DC characteristics. These techniques aim to optimize the electrostatics and carrier transport by introducing potential steps or doping asymmetry in the channel, thereby enhancing device scalability and linearity for nanoscale transistor applications.
2. What are the challenges and methods for accurate extraction and modeling of MOSFET intrinsic parameters, including source/drain series resistances and parasitic capacitances, for device and circuit simulations?
Accurate device parameter extraction and modeling is critical for reliable MOSFET performance prediction and circuit design, especially with nanoscale devices where parasitic resistances and capacitances significantly affect switching speed and analog characteristics. This theme covers experimental and theoretical approaches to separate intrinsic device characteristics from extrinsic parasitic effects. It includes development and evaluation of extraction techniques for individual source/drain resistances, modeling the impact of parasitic junction and gate capacitances, and assessing high-frequency behavior through small-signal equivalent circuits.
3. How do MOSFET device scaling and alternative materials like III-V semiconductors and 2D materials influence electrical parameters and technology scalability?
This theme explores the impact of dimensional downscaling and alternative channel materials (e.g., III-V compounds, MoS2, and silicon superjunction structures) on MOSFET device parameters such as threshold voltage, breakdown voltage, on-resistance, and RF performance metrics. It addresses the physical and technological challenges for future technology nodes, including material surface properties, Fermi level pinning, and tradeoffs between conduction and switching losses in power MOSFETs. The research also covers how novel device architectures and doping engineering can enable improved device scalability and efficiency.