Papers by Howard Davidson
An Eotvos experiment employing a fluid bearing and electrostatic fiber
The limitation on the sensitivity of torsion pendulum instruments in general, and on the Eotvos e... more The limitation on the sensitivity of torsion pendulum instruments in general, and on the Eotvos experiment in particular, is the relationship between the torsion coefficient and breaking load of the fiber. This limitation may be overcome by separating the application of restoring force to the pendulum from the support function by using buoyant support and applying the restoring force electrostatically. Using dichlorodifluoromethane, a value for the Eotvos coefficient of 5.46 x 10 to the minus 10 power + or - 5.44 x 10 to the minus 10 power was obtained. Methods are provided for mathematically predicting the performance of similar systems. General design guidelines for the implementation of this technique are also provided.
1995 Proceedings. 45th Electronic Components and Technology Conference, 1995
The application of high power density electronic components such as fast microprocessors and powe... more The application of high power density electronic components such as fast microprocessors and power semiconductors is often limited by an inability to maintain the device junctions below their maximum rated operating temperature. The junction temperature rise is determined by the thermal resistance from junction to the ambient thermal environment. Two of the largest contributions to this thermal resistance are the die attach interface and the package base. A decrease in these resistances can allow increased component packing density in MCMs, reduction of heat sink volume in tightly packed systems, enable the use of higher performance circuit components, and improve reliability. The substrate for a multichip module or device package is the primary thermal link between the junctions and the heat sink. Present high power multichip module and single chip package designs use substrate materials such as silicon nitride or copper tungsten that have thermal conductivity in the range of 200 W...
A simple method for cleaning the surface of mercury
Review of Scientific Instruments, 1974
Surface dust and oxidation may be easily removed from a pool of mercury by embedding the material... more Surface dust and oxidation may be easily removed from a pool of mercury by embedding the material in a film of collodion which is poured onto the mercury and then removed.
Stackable heat pipe for a three-dimensional compact arrangement of electronic components
Integrated heat pipe and the electronic circuit assembly and method of integrating them
(57) [Summary] [Objective] To obtain an optimized integrated heat pipe and electronic circuit mod... more (57) [Summary] [Objective] To obtain an optimized integrated heat pipe and electronic circuit module. [Structure] A metallization and a thermal wick are previously attached to the side of the ceramic multi-chip module supporting the electronic circuit component opposite to the electronic circuit component. The heat pipe evaporator chamber and condenser assembly is attached to the multichip module and wick assembly. A suitable working fluid is injected into the steam chamber. By attaching the heat wick to the heat generating multi-chip module, the heat impedance due to the heat transfer medium used in the conventional heat pipe assembly is eliminated, and the heat flux transferred from the multi-chip module to the heat pipe evaporator is eliminated. Can be doubled.
Fluid circuit connector system
Method and apparatus for interconnect diagnosis
Optical interconnects: out of the box forever
IEEE Journal of Selected Topics in Quantum Electronics, 2003
1995 Proceedings. 45th Electronic Components and Technology Conference, 1995
Copper-Diamond Composite Substrates for Electronic Components DISCLAIMER This document was prepar... more Copper-Diamond Composite Substrates for Electronic Components DISCLAIMER This document was prepared as an account of work sponsored by an agency of the United States Government. Neither the United States Government nor the University of California nor any of their employees, makes any warranty, express or implied, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any information, apparatus, product, or process disclosed, or represents that its use would not infringe privately owned rights. Reference herein to any specific commercial product, process, or service by trade name, trademark, manufacturer, or otherwise, does not necessarily constitute or imply its endorsement, recommendation, or favoring by the United States Government or the University of California. The views and opinions of authors expressed herein do not necessarily state or reflect those of the United States Government or the University of California, and shall not be used for advertising or product endorsement purposes. A DISCLAIMER Portions of this document may be illegible in electronic image products. images are produced from the best available original document.
Cooling device for compact three-dimensional electronic device
PURPOSE: To improve the cooling efficiency of a cooling device in a compact electronic device hav... more PURPOSE: To improve the cooling efficiency of a cooling device in a compact electronic device having plural electronic circuit modules, including plural electronic circuit elements. CONSTITUTION: Each of plural essentially equal temperature heat pipes 10 integrally houses at least one of electronic circuit modules 15, and when it is integrated with an electronic circuit module, plural heat pipes/electronic modules 30 are formed. A connector 20 mutually connects the electronic circuit modules. A clamp structure holds a mechanical and electronic contact of the heat pipe/ electronic module, and the heat pipe/electronic modules are successively stacked up so that the heat pipe of each heat pipe/electronic module can be brought into contact vertically with the heat pipe of the adjacent that pipe/electronic module.
Compresseur a electro-desorption
L'invention concerne un systeme de compression a electro-desorption (10, 200, 300, 400, 500, ... more L'invention concerne un systeme de compression a electro-desorption (10, 200, 300, 400, 500, 600) qui comprend une enceinte (30) dotee d'un sorbant place entre un premier et un second conducteur espaces (14, 14', 16, 16'), d'un sorbat capable de former avec le sorbant un compose sorbant/sorbat (18, 18'), et d'une alimentation (20) reliee aux conducteurs (14, 14', 16, 16') pour acheminer un courant electrique a travers le compose sorbant/sorbat (18, 18') afin de desorber le sorbat du sorbant dans une reaction de desorption non thermique. Le systeme comporte egalement une chambre de pression ( 22, 56, 58, 76, 92) reliee a l'enceinte (30) et recevant le sorbat de l'enceinte (30) au cours de la desorption et liberant le sorbat de l'enceinte (30) au cours d'une reaction d'absorption. Les reactions d'absorption et de desorption sont repetees afin de cycliquement faire passer le sorbat d'un etat de basse pression lors de l...
Low permeability hose system
Open fiber safety interlock
<title>An Approach To Real Time Holography</title>
Intl Conf on Computer-Generated Holography, 1983
Method for cooling backside optically probed integrated circuits
Dymalloy: A composite substrate for high power density electronic components
Description/Abstract High power density electronic components such as fast microprocessors and po... more Description/Abstract High power density electronic components such as fast microprocessors and power semiconductors must operate below the maximum rated device junction temperature to ensure reliability. function temperatures are determined by the ...
High resolution color computer display to be worn on the head of an operator
Method and apparatus for making a sorber
Providing a Collaborative Status Message in an Instant Messaging System
High resolution colour computer display to be worn on the head of an operator
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Papers by Howard Davidson