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‘mo — Note: ‘-‘indicates no significant effect, ‘(’ indicates increase in mechanical property with increase in quantity/parameter, ‘( indicates decrease in mechanical property with increase in quantity/parameter. Table 1. Effects of various quantities/oarameters on mechanical response of MMNCs [2].

Table 1 ‘mo — Note: ‘-‘indicates no significant effect, ‘(’ indicates increase in mechanical property with increase in quantity/parameter, ‘( indicates decrease in mechanical property with increase in quantity/parameter. Table 1. Effects of various quantities/oarameters on mechanical response of MMNCs [2].

Related Figures (15)

Figure 1. Manufacturing procedure for the A356/SiC foam composite [9].
Figure 1. Manufacturing procedure for the A356/SiC foam composite [9].
Figure 2. Schematic CAD diagram of the vacuum infiltration apparatus [9].
Figure 2. Schematic CAD diagram of the vacuum infiltration apparatus [9].
Figure 3. Schematic of the vertical centrifugal casting machine, Huang et al. [16].
Figure 3. Schematic of the vertical centrifugal casting machine, Huang et al. [16].
Figure 5. Schematic diagram of horizontal centrifugal casting equipment used for fabricating F@MMC [17]. Figure 4. Lower iron mold and cores [16].
Figure 5. Schematic diagram of horizontal centrifugal casting equipment used for fabricating F@MMC [17]. Figure 4. Lower iron mold and cores [16].
Figure 7. Schematic of the experimental apparatus [21]. Figure 6. (a) Schematic of conventional spray method to produce MMC powders and (b) schematic of the new method for production of Al/SiC MMC: Centrifugal atomization with particle injection [21].
Figure 7. Schematic of the experimental apparatus [21]. Figure 6. (a) Schematic of conventional spray method to produce MMC powders and (b) schematic of the new method for production of Al/SiC MMC: Centrifugal atomization with particle injection [21].
Figure 9. Schematic of experimental set-up used by Amirkhanlou e¢ al. [28]. Figure 8. Schematic of experimental set-up used by Abbasipour ef al. [26].
Figure 9. Schematic of experimental set-up used by Amirkhanlou e¢ al. [28]. Figure 8. Schematic of experimental set-up used by Abbasipour ef al. [26].
Figure 10. Schematic illustration of ARB process [28].
Figure 10. Schematic illustration of ARB process [28].
Figure 11. Rig used to produce cast MMC [29].
Figure 11. Rig used to produce cast MMC [29].
Figure 12. Schematic of constructed compocaster [30].
Figure 12. Schematic of constructed compocaster [30].
Figure 13. Schematic illustration of the mixing equipment used for (a) the distributive mixing process and (b) the Rheo-process [31].
Figure 13. Schematic illustration of the mixing equipment used for (a) the distributive mixing process and (b) the Rheo-process [31].
Figure 14. Schematic view of setup for Fabrication of composite [33].
Figure 14. Schematic view of setup for Fabrication of composite [33].
Table 2. AISiC Material Properties Compared with Common Packaging, Substrate and IC Materials [41]. producible by conventional techniques. Nevertheless, MMCs reinforced with particles tend to offer modest enhancement of properties, but are more isotropic and can be processed by conventional routes [41]. compatible with direct IC device attachment for the maximum thermal dissipation through the 170 — 200 W/mK thermal conductivity value of the material [9,42,43], see Table 2. Additionally, the low material density of AISiIC makes it ideal for weight sensitive applications such as portable devices.
Table 2. AISiC Material Properties Compared with Common Packaging, Substrate and IC Materials [41]. producible by conventional techniques. Nevertheless, MMCs reinforced with particles tend to offer modest enhancement of properties, but are more isotropic and can be processed by conventional routes [41]. compatible with direct IC device attachment for the maximum thermal dissipation through the 170 — 200 W/mK thermal conductivity value of the material [9,42,43], see Table 2. Additionally, the low material density of AISiIC makes it ideal for weight sensitive applications such as portable devices.
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Metal Matrix CompositesAluminium Matrix Composites
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