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Table 2. AISiC Material Properties Compared with Common Packaging, Substrate and IC Materials [41].  producible by conventional techniques. Nevertheless, MMCs reinforced with particles tend to offer modest enhancement of properties, but are more isotropic and can be processed by conventional routes [41].  compatible with direct IC device attachment for the maximum thermal dissipation through the 170 — 200 W/mK thermal conductivity value of the material [9,42,43], see Table 2. Additionally, the low material density of AISiIC makes it ideal for weight sensitive applications such as portable devices.

Table 2 AISiC Material Properties Compared with Common Packaging, Substrate and IC Materials [41]. producible by conventional techniques. Nevertheless, MMCs reinforced with particles tend to offer modest enhancement of properties, but are more isotropic and can be processed by conventional routes [41]. compatible with direct IC device attachment for the maximum thermal dissipation through the 170 — 200 W/mK thermal conductivity value of the material [9,42,43], see Table 2. Additionally, the low material density of AISiIC makes it ideal for weight sensitive applications such as portable devices.