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Fig. 1. Diffraction pattern of 3C-SiC/Si(1 | 1) structure: for film thickness (a) 140 nm and (b) 420 nm.  Silicon carbide polycrystalline target was sput- tered on properly prepared commercially avail- able silicon substrates (with orientation of sur- face deflected from (1 1 1) plane). Temperature of the films preparation was 950 °C to 1100 °C. The chamber was evacuated to a vacuum of 1.33 x 10~4 Pa before starting the flow of inert gas (Ar) for sputtering the target material. The samples were taken from the chamber after cooling to room temperature. The technology details were reported in [19, 20]. Since silicon carbide does not oxidize in air, the exposition of the samples to the air did not influence its characteristics. The thicknesses of the films were measured by observing the samples crossections using scanning electron microscope. X-ray diffraction data proved the presence of 3C-SiC cubic modification (Fig. 1).

Figure 1 Diffraction pattern of 3C-SiC/Si(1 | 1) structure: for film thickness (a) 140 nm and (b) 420 nm. Silicon carbide polycrystalline target was sput- tered on properly prepared commercially avail- able silicon substrates (with orientation of sur- face deflected from (1 1 1) plane). Temperature of the films preparation was 950 °C to 1100 °C. The chamber was evacuated to a vacuum of 1.33 x 10~4 Pa before starting the flow of inert gas (Ar) for sputtering the target material. The samples were taken from the chamber after cooling to room temperature. The technology details were reported in [19, 20]. Since silicon carbide does not oxidize in air, the exposition of the samples to the air did not influence its characteristics. The thicknesses of the films were measured by observing the samples crossections using scanning electron microscope. X-ray diffraction data proved the presence of 3C-SiC cubic modification (Fig. 1).