513761 A7 ' B7 ' 五、發明説明（1 ) 發明領域 " 本發明係關於一種晶圓保護方法及系統，特別是關於一 種半導體酸清洗槽之晶圓保護方法及系統。 發明背景 就目前的半導體之酸清洗槽（wet bench)而言，大都包含 數個裝有不同種類酸液之處理槽、一洗濯（rinse)槽、一晶 片旋乾（spin drying)室或附加沖洗作用之旋乾室（Spin Rinse Dry ; SRD)，其目的主要是要去除金屬和有機物（organic)之 污染（contamination)以及各種微塵（particle)。晶圓（wafer)大 部分是由一晶舟盒（cassette)承載，並以一機械手臂傳送該 晶舟盒依序經由各處理槽之浸泡，以及經洗濯槽沖洗後， 等待進入旋乾室。晶圓進行旋乾前必須先將晶舟盒中的晶 圓加以固定，以避免後續進行旋乾時因為晶圓的相互碰撞 或滑出（slip out)而造成晶圓的破片。 參照圖1，晶圓1 0在進入旋乾室前，會先將位於一晶舟 盒1 2中的晶圓1 0頂起，然後在以兩片夬板1 4將該晶圓10 固定，該夾板1 4具有溝槽1 6以間隔各晶圓1 0。因為有此 固定之動作，所以當該晶圓1 〇於晶舟盒1 2中的位置不當 時，可能造成頂起時該晶圓1 0位置之偏離，使得後續以爽 板1 4進行固定時，造成該晶圓1 0之損壞。或是因夾持不 當，而在進行高速旋乾時，造成該晶圓1 0脫離，甚至損壞 機台中之構件。 一般而言，酸清洗槽中常包含具危險性之酸驗溶液，例 如著名的用以去除微塵和有機物污染之R C A清洗製程的 HAHU\TYS\瑞耘科技中說\酸攢之監控方法(73477).DOC - 4 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)513761 A7 'B7' V. Description of the invention (1) Field of invention " The present invention relates to a method and a system for protecting a wafer, and more particularly to a method and a system for protecting a semiconductor acid cleaning tank. BACKGROUND OF THE INVENTION As far as the current semiconductor acid cleaning tanks are concerned, most of them include several processing tanks filled with different types of acid liquids, a rinse tank, a wafer drying chamber or an additional rinse. The function of the Spin Rinse Dry (SRD) is to remove contamination of metals and organics and various particles. Most of the wafers are carried by a cassette, and a robotic arm transports the wafer box through the immersion in the processing tanks in sequence, rinsed in the washing tank, and waits to enter the spin-drying chamber. The wafers in the wafer box must be fixed before the wafers are spin-dried to avoid the wafers from being broken due to the collision or slip out of the wafers during the subsequent spin-drying. Referring to FIG. 1, before the wafer 10 enters the spin-drying chamber, the wafer 10 in a wafer box 12 is jacked up first, and then the wafer 10 is fixed with two cymbals 14. The splint 14 has grooves 16 spaced from each wafer 10. Because of this fixing action, when the position of the wafer 10 in the wafer box 12 is improper, it may cause the position of the wafer 10 to deviate when it is jacked up. , Causing damage to the wafer 10. Or due to improper clamping, the wafer 10 detached during high-speed spin-drying, and even the components in the machine were damaged. Generally speaking, acid cleaning tanks often contain dangerous acid test solutions, such as the well-known RCA cleaning process used to remove dust and organic contamination from HAHU \ TYS \ Ruiyun Technology \ Acid monitoring method (73477) .DOC-4-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
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k 513761 A7 ___ B7 五、發明説明（2 ) S C - 1，係由氫氧化氨（NH4OH)、雙氧水（H202)以及水之混 和溶液所組成，用以去除本生氧化物（native oxide)及金屬不 純物（metallic impurities)之氫氟酸（HF)溶液，以及用以去除 光阻（photoresist)之熱硫酸（H2S04)和雙氧水（H202)混和溶 液。因此，當該晶圓1 〇在固定時所造成之失誤，常需要工 程師以人工方式處理，此時，由於常常在該晶圓1 0上仍有 殘留之酸鹼溶液，將造成前往處理之工作人員的危險及不 方便。此外，由於該晶圓1 〇固定的位置不當亦會增加誤訊 號的機率，而影響其產能。 參照圖2，進行其他單片晶圓（single wafer)製程時，晶圓 2 0於晶舟盒2 2中之位置大部分為平放狀態，因重力之影 響，各晶圓2 0將接觸該晶舟盒2 2中其所屬溝槽2 4之下 緣’使得各晶圓2 0之位置一定，亦就是有相等之間距，且 尊間距都留有一適當之大小，供各製程機台以機械平板 (robot blade)(圖未示出）取放該晶圓2 〇之用，所以各晶圓 2 0彼此處於平行狀態。 一般於酸清洗槽中所使用之晶舟盒並不同於其他製程機 台中所使用的晶舟盒，例如上述之單片晶圓製程機台所使 用的該晶舟盒2 2，該晶圓1 0由載入機台s ΜI F (圖未示 出）載入後’把原本之晶舟盒22留於原本的包覆盒（p〇d) 中，而以一酸清洗槽專用之該晶舟盒丨2承載，該晶舟盒i 2 具有抗酸驗等功能以適應其工作環境。晶圓1 〇於酸清洗槽 中處理時，晶圓1 0為豎立排放，其目的為利用重力使晶圓 1 〇較不容易滑脫以及晶圓1 〇上經處理後所殘留之酸液較容 H:\HU\TYS\瑞転科技中說\酸槽之監控方法(73477).DOC · ·5 - 本紙張尺度適用巾國g家標準(CNS) Α4規格(210X297公董)'· "" 五、發明說明（3 礼卜’所以其間隔不像一般製程機台有一固定的間距。 ^正常狀況下，仍在一定範圍内，如圖3 ( a)所示係圖1之 曰9圓固定裝置之右視圖。在進行酸液槽之浸泡時，該晶圓 1 0疋整批由機械手臂傳送，該晶圓1 〇於晶舟盒1 2中之位 置可容許有較大之誤差，但該晶圓1 0在進行旋乾前之固定 nJL. . 、’，、間距就變得非常重要，萬一狀況異常造成該晶圓1 0 偏斜’如圖3 (b )所示，將增加後續因固定該晶圓1 〇而停機 之機率。 目前廠商提供不同型式之晶舟盒12，其中部分之晶舟盒 1 2包覆晶圓1 〇之範圍較小，使得該晶圓1 〇較突出於該晶 舟盒12 ’更容易遭遇上述晶圓1〇之固定問題。 要說明 本發明的目的是利用一晶圓保護方法，以防止晶圓損壞 冬減少機台停機的機率。本發明係利用擷取晶圓進入旋乾 立‘之影像來判斷晶圓之位置是否適當，以避免後續進行 固定時晶圓的毁損，或是進行旋乾時，晶圓滑出撞擊機台 構件而造成停機。 根據本發明的較佳實施例之晶圓保護方法，應用於一酸 清洗槽’該晶圓係以一晶舟盒承載，該晶圓監控方法係以 一攝影機擴取該晶圓在旋乾室載入台之影像，並將該影像 線條化’若至少一個相鄰的兩線條之間距大於一預定閥值 (threshold)，表示該兩線條所代表之兩晶圓中至少一晶圓位 置不當’則停止該酸清洗槽之運作。此外，亦可額外擷取 該晶圓在酸清洗槽載入台及載出台之影像，並同樣將該影 H:\HU\TYS\瑞耘科技中說\酸槽之監控方法(73477).DOC - 0 · 本紙張尺度適用中國國家標準(CNS) Α4β格(210 X 297公I) ----- 513761 A7 ' B7 五、發明説明（4 ) 像進行線條化分析，藉此判斷該晶圓在酸清洗槽中各製程 步驟中的位置是否適當。 根據本發明之較佳實施例之晶圓保護系統，係應用於一 酸清洗槽，該晶圓監控系統包含：一旋乾室、一攝影機、 一電腦以及一遠端輸入/輸出模組。該旋乾室用以旋乾該 晶圓。該攝影機，用以擷取該晶圓在進入旋乾室前之影 像。該電腦，用以將該影像進行線條化分析。當該電腦分 析有異常現象，該遠端輸入/輸出模組用以停止該酸清洗 槽之運作。 圖式之簡單說明 本發明將依照後附圖式來說明，其中： 圖1係習知之酸清洗槽之旋乾室之晶圓固定裝置之示意 圖， .圖2係習知之單片晶圓製程之晶舟盒和其所載晶圓位置 之示意圖； 圖3 ( a)及圖3 (b )係圖1之晶圓固定裝置之右視圖； 圖4係本發明之晶圓保護系統之示意圖； 圖5係本發明之晶圓保護方法之流程圖； 圖6係本發明之另一晶圓保護方法之流程圖；以及 圖7係本發明之另一晶圓影像擷取裝置之示意圖。 元件符號說明 10晶圓 12晶舟盒 14夾板 1 6溝槽 20晶圓 22晶舟盒 HAHU\TYS\瑞転科技中說\酸槽之監控方法(73477>.DOC _ 7 · 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐） 513761 A7 B7 五、發明説明（5 ) 24溝槽 4 0酸清洗槽 4 0 2洗濯槽 42 CCD攝影機 46影像擷取卡 5 0遠端輸入/輸出模組 7 0載入台 74、76CCD攝影機 4 0 1酸液槽 4 03旋乾室 4 4晶圓 48電腦 72載出台 較佳實施例說明 參照圖4，一酸清洗槽4 〇包含至少一個酸液槽4 〇 1、一 洗濯槽4 0 2以及一旋乾室4 〇 3，以一 c c D ( charge coupled device)攝影機42架設於該酸清洗槽4〇的旋乾室403之載入 台（圖未示出）上方，用以擷取該載入台上晶圓44的影 像，其擴取之範圍可經測試由工作人員自行設定。藉由一 影像擴取卡4 6，將該C C.D攝影機4 2得到的影像傳送至一 電腦4 8以進行影像之分析或儲存。一遠端輸入/輸出模組 5 0，用以接收該電腦4 8的指令，並連接至該酸清洗槽 4 0，一旦察覺到異常現象，可使該酸清洗槽4 〇停機以避免 該晶圓4 4的損壞。 圖5係本發明之晶圓保護方法的流程圖。首先，由c c D 攝影機4 2擷取晶圓4 4在旋乾室4 0 3載入台上的影像，若其 判斷該晶圓4 4已就旋乾室4 0 3之載入台上，則將該影像進 行線條化處理。在進行以上處理時，須注意C C D攝影機4 2 架設之位置必須位於該晶圓4 4的上方或側面，且其角度必k 513761 A7 ___ B7 V. Description of the Invention (2) SC-1 is composed of a mixed solution of ammonia hydroxide (NH4OH), hydrogen peroxide (H202), and water to remove native oxides and metals A solution of metal impurities in hydrofluoric acid (HF) and a mixed solution of hot sulfuric acid (H2S04) and hydrogen peroxide (H202) to remove photoresist. Therefore, when the wafer 10 is fixed, errors often need to be handled manually by the engineer. At this time, because there is still a residual acid-base solution on the wafer 10, it will cause work to be processed. Danger and inconvenience to personnel. In addition, the improperly fixed position of the wafer 10 will also increase the probability of false signals and affect its capacity. Referring to FIG. 2, when performing other single wafer processes, most of the positions of the wafers 20 in the wafer box 22 are flat. Due to the influence of gravity, each wafer 20 will contact the wafer. The lower edge of the groove 2 4 in the wafer box 22 makes the positions of the wafers 20 constant, that is, there is an equal distance between them, and a proper size is reserved for each process machine to use mechanical flat plates. (robot blade) (not shown) for picking and placing the wafer 20, so each wafer 20 is in a parallel state with each other. The wafer box generally used in the acid cleaning tank is different from the wafer box used in other process equipment, for example, the wafer boat case 22 used in the above-mentioned single wafer process machine, and the wafer 10 After loading by the loading machine s MI F (not shown), the original wafer boat box 22 is left in the original coating box (pod), and the wafer boat is cleaned by an acid cleaning tank. Carrying box 丨 2, the wafer boat box i 2 has functions such as acid resistance to adapt to its working environment. When the wafer 10 is processed in the acid cleaning tank, the wafer 10 is vertically discharged. The purpose is to use gravity to make the wafer 10 less likely to slip off and the acid solution remaining on the wafer 10 after treatment Rong H: \ HU \ TYS \ Ruiying Technology said \ Acid tank monitoring method (73477) .DOC · · 5-This paper size is applicable to national standards (CNS) Α4 specifications (210X297 public director) '& " " V. Description of the invention (3 Li Bu's, so its interval is not a fixed distance like ordinary process machines. ^ Under normal conditions, it is still within a certain range, as shown in Figure 3 (a) is shown in Figure 1 Right side view of the 9-circle fixing device. During the soaking of the acid bath, the entire batch of the wafer 10 is transported by a robot arm, and the wafer 10 can be allowed to have a larger position in the wafer box 12 Error, but the fixed nJL of the wafer 10 before spin-drying.., ', And the pitch becomes very important. In case of abnormal conditions causing the wafer 10 to skew, as shown in Figure 3 (b) , Will increase the probability of subsequent shutdown due to the fixation of the wafer 10. At present, the manufacturer provides different types of wafer boat boxes 12, some of which are covered with wafer 1 The smaller range of 〇 makes the wafer 10 more prone to the wafer 10 fixing problem than the wafer box 12 ′. To explain the purpose of the present invention is to use a wafer protection method to prevent the wafer Circle damage in winter reduces the chance of machine downtime. The present invention uses the image of the wafer to be taken into the spin-dry stand to determine whether the position of the wafer is appropriate to avoid the damage of the wafer during subsequent fixation or spin-drying. When the wafer slides out and hits the machine components, it causes a shutdown. The wafer protection method according to the preferred embodiment of the present invention is applied to an acid cleaning tank. The wafer is carried by a wafer box, and the wafer monitoring method A camera is used to enlarge the image of the wafer on the loading table of the spin-drying chamber and line the image. If the distance between at least one adjacent two lines is greater than a predetermined threshold, it indicates that the two lines are If at least one of the two wafers is improperly located, the operation of the acid cleaning tank is stopped. In addition, the image of the wafer in the acid cleaning tank loading and unloading station can be additionally captured, and the image can also be captured. H: \ HU \ TYS \ Rui In science and technology, the monitoring method of acid tank (73477) .DOC-0 · This paper size is applicable to Chinese National Standard (CNS) Α4β grid (210 X 297 male I) ----- 513761 A7 'B7 V. Description of the invention ( 4) A line analysis is performed on the image to determine whether the position of the wafer in each process step in the acid cleaning tank is appropriate. The wafer protection system according to a preferred embodiment of the present invention is applied to an acid cleaning tank. The wafer monitoring system includes: a spin-drying chamber, a camera, a computer, and a remote input / output module. The spin-drying chamber is used to spin-dry the wafer. The camera is used to capture the wafer Image before entering the spin-drying chamber. The computer is used for line analysis of the image. When the computer analyzes an abnormal phenomenon, the remote input / output module is used to stop the operation of the acid cleaning tank. Brief description of the drawings The present invention will be explained according to the following drawings, in which: Figure 1 is a schematic diagram of a wafer fixing device of a spin drying chamber of a conventional acid cleaning tank, and Figure 2 is a conventional single wafer manufacturing process. Schematic diagram of wafer boat box and its wafer position; Figures 3 (a) and 3 (b) are right side views of the wafer fixing device of Figure 1; Figure 4 is a schematic diagram of the wafer protection system of the present invention; 5 is a flowchart of the wafer protection method of the present invention; FIG. 6 is a flowchart of another wafer protection method of the present invention; and FIG. 7 is a schematic diagram of another wafer image capture device of the present invention. Description of component symbols 10 wafers 12 wafer box 14 plywood 1 6 grooves 20 wafers 22 wafer box HAHU \ TYS \ Ruiying Technology said \ Acid tank monitoring method (73477 > .DOC _ 7 · This paper size applies China National Standard (CNS) A4 specification (210X 297 mm) 513761 A7 B7 V. Description of the invention (5) 24 groove 4 0 acid cleaning tank 4 0 2 washing tank 42 CCD camera 46 image capture card 50 0 remote input / Output module 7 0 loading stage 74, 76 CCD camera 4 0 1 acid tank 4 03 spin-drying chamber 4 4 wafer 48 computer 72 loading stage Description of a preferred embodiment Referring to FIG. 4, an acid cleaning tank 4 includes at least An acid solution tank 401, a washing tank 402, and a spin-drying chamber 403 are loaded in the spin-drying chamber 403 of the acid cleaning tank 40 with a cc D (charge coupled device) camera 42. Above the stage (not shown in the figure), it is used to capture the image of the wafer 44 loaded on the stage. The expanded range can be set by the staff after testing. With an image expansion card 4 6 The image obtained by C CD camera 4 2 is transmitted to a computer 4 8 for image analysis or storage. A remote input / output module 50 is used for Receive the instructions from the computer 48 and connect to the acid cleaning tank 40. Once an abnormal phenomenon is detected, the acid cleaning tank 40 can be stopped to avoid damage to the wafer 44. Figure 5 is the crystal of the present invention The flow chart of the circle protection method. First, the cc D camera 4 2 captures the image of the wafer 4 4 in the spin-drying chamber 4 0 3 loading table. If it judges that the wafer 4 4 has been spin-drying the chamber 4 0 On the loading table of 3, the image is subjected to line processing. In the above processing, it must be noted that the CCD camera 4 2 must be set up above or on the side of the wafer 4 4 and its angle must be
HAHU\TYS\瑞転科技中說\酸槽之監控方法(73477)DOC 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 裝 訂HAHU \ TYS \ Ruiying Technology said \ Acid tank monitoring method (73477) DOC This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) binding
k 513761 A7 ____ B7 _____ 五、發明説明（6 ) 須儘量與該晶圓4 4之角度平行，即使得各晶圓4 4於此角度 所得到影像儘量成為一直線，以方便下一階段的線條化處 理。經線條化處理後，若相鄰之兩線條之間距大於一閥 值，例如1 5 mm，則表示相鄰之兩晶圓中至少有一晶圓位 置不當。此時可將该影像存成一點陣圖樓（bmp file)供後續 維修人員分析之用，並透過一遠端輸入/輸出模組5 〇告知 該酸洗槽40此異常狀況，令其停機以進行檢修。上述之閥 值可由工作人貝依其需要自行設定，但必須考量其敏感度 問題以防止誤訊號之產生。此外，因為此擷取之狀態為晶 圓44位於旋乾室403之載入台上之靜止狀態，所以亦可以 將本系統與該酸清洗槽4 0連線，當晶圓4 4位於旋乾室4 0 3 載入台之上時，即告知本系統之電腦4 8開始擷取晶圓4 4之 影像，如此一來，可不必一直作影像的擷取，相對地降低 得到誤訊號之機率並節省資源，其流程如圖6所示。 參照圖7，在本系統於該酸清洗槽4 0之載入台（loading stage) 7 0和載出台（unloading stage) 72額外加裝兩台CCD攝 影機74、76來擴取該處晶圓44之影像，並和旋乾室403上 方之C C D攝影機4 2所擷取之影像作同樣之線條化分析，其 功用可分析該晶圓4 4位置不當是由那一階段所引起。此外 也可避免當該晶圓4 4經酸清洗槽4 0處理完之後，傳回 S Μ I F時因該晶圓4 4位置不當所造成的破片或停機等問 題。 本發明之技術内容及技術特點已揭示如上，然而熟悉本 項技術之人士仍可能基於本發明之教示及揭示而作種種不 -Q - H:\HU\TYSU^耘科技中說\酸槽之&控方法(73477).DOC ~ 7 " 本紙張尺度適用中國國家標準(CNS) A4规格(210 X 297公着） 513761 A7 B7 五、發明説明（ 背離本發明精神之替換及修飾。因此，本發明之保護範圍 應不限於實施例所揭示者，而應包括各種不背離本發明之 替換及修飾，並為以下之申請專利範圍所涵蓋。 -10k 513761 A7 ____ B7 _____ 5. Description of the invention (6) The angle of the wafer 4 4 must be as parallel as possible, that is, the image obtained by each wafer 4 4 at this angle should be as straight as possible to facilitate the next stage of lineization. deal with. After the line processing, if the distance between two adjacent lines is greater than a threshold, such as 15 mm, it means that at least one of the two adjacent wafers is improperly positioned. At this time, the image can be saved as a bmp file for subsequent maintenance personnel to analyze, and a remote input / output module 50 is used to inform the pickling tank 40 of this abnormal condition, and cause it to stop. Perform maintenance. The above thresholds can be set by the workers themselves according to their needs, but their sensitivity issues must be considered to prevent false signals. In addition, because the captured state is a stationary state where the wafer 44 is located on the loading table of the spin-drying chamber 403, the system can also be connected to the acid cleaning tank 40. When the wafer 44 is located in the spin-drying When the room 4 0 3 is loaded on the table, the computer 4 8 of this system is informed to start capturing the image of the wafer 4 4. In this way, it is not necessary to always capture the image, and the probability of getting a false signal is relatively reduced. And save resources, the process is shown in Figure 6. Referring to FIG. 7, two additional CCD cameras 74 and 76 are added to the loading stage 70 and the unloading stage 72 of the acid cleaning tank 40 in the system to expand the wafer 44 there. The image is analyzed in the same line as the image captured by the CCD camera 4 2 above the spin-drying chamber 403, and its function can analyze the stage where the improper position of the wafer 44 is caused. In addition, problems such as chipping or shutdown caused by improper position of the wafer 44 when the wafer 44 is returned after the wafer 44 is processed in the acid cleaning tank 40 can also be avoided. The technical content and technical features of the present invention have been disclosed as above. However, those who are familiar with this technology may still make all kinds of inconsistencies based on the teaching and disclosure of the present invention. -Q-H: \ HU \ TYSU & Control method (73477) .DOC ~ 7 " This paper size is applicable to Chinese National Standard (CNS) A4 specifications (210 X 297) 513761 A7 B7 5. Description of the invention (substitutions and modifications that depart from the spirit of the invention. Therefore The protection scope of the present invention should not be limited to those disclosed in the embodiments, but should include various substitutions and modifications that do not depart from the present invention, and are covered by the following patent application scope. -10
H AHUVT YS\瑞転科技中說\酸槽之監控方法(73477). DOC 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐）H AHUVT YS \ Ruiying Technology \ Acid tank monitoring method (73477). DOC This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm)