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Table 4 Pre-Layout Simulation Results The acquisition bandwidth pre-layout is significantly greater than that of

Table 4 Pre-Layout Simulation Results The acquisition bandwidth pre-layout is significantly greater than that of

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rate, which is shown in Fig.1 The PAM4 signal entering the chip is differential with 4 levels. The rise and way to look at it is that it achieves higher resolution using the same sampling Nyquist frequency or double the throughput for the same Baud rate. Another
rate, which is shown in Fig.1 The PAM4 signal entering the chip is differential with 4 levels. The rise and way to look at it is that it achieves higher resolution using the same sampling Nyquist frequency or double the throughput for the same Baud rate. Another
Table 1 Marketing Requirements The following sections go deeper into the requirements such as the acquisi-
Table 1 Marketing Requirements The following sections go deeper into the requirements such as the acquisi-
Marketing Requirement Engineering Requirement
Marketing Requirement Engineering Requirement
Fig. 2 Acquisition Time from Level 2 to Level 3 2.2 Hold Error & Droop Rate
Fig. 2 Acquisition Time from Level 2 to Level 3 2.2 Hold Error & Droop Rate
The droop rate, is a measure of the rate at which the output voltage is As for the droop rate, it is calculated in the following manne1
The droop rate, is a measure of the rate at which the output voltage is As for the droop rate, it is calculated in the following manne1
Fig. 4 Pedestal Error Visual Representation the excess charges. A visual representation is seen in Fig. - Additionally, drain-source-connected transistors are used to absorb some of 2.4 Power Consumption
Fig. 4 Pedestal Error Visual Representation the excess charges. A visual representation is seen in Fig. - Additionally, drain-source-connected transistors are used to absorb some of 2.4 Power Consumption
Fig. 5 Functional Decomposition for the proposed T&H Circuit targeted application for this particular IC. circuit into a set of sub-blocks that aim to familiarize the reader with th In this section, we break down the block design of our proposed integrated
Fig. 5 Functional Decomposition for the proposed T&H Circuit targeted application for this particular IC. circuit into a set of sub-blocks that aim to familiarize the reader with th In this section, we break down the block design of our proposed integrated
Table 3 Summary of T&H Architectures
Table 3 Summary of T&H Architectures
Two supply domains are needed for a proper operation, AVDD_3P1, which
Two supply domains are needed for a proper operation, AVDD_3P1, which
6 Simulation Results
6 Simulation Results
Table 5 Post-Layout Results and pedestal error are both smaller post-layout. There is a noticeable decrease
Table 5 Post-Layout Results and pedestal error are both smaller post-layout. There is a noticeable decrease
Fig. 8 Pre and Post-Layout Output Signal Waveform Table 6 is a comparison of the specifications of our design with that of [8]
Fig. 8 Pre and Post-Layout Output Signal Waveform Table 6 is a comparison of the specifications of our design with that of [8]
Table 6 Comparison of Our Specifications with Respect to [8] -AMA4 signal at 0.2 GS/s consuming less than 50 mW while in operation.
Table 6 Comparison of Our Specifications with Respect to [8] -AMA4 signal at 0.2 GS/s consuming less than 50 mW while in operation.
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