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Fig.3 Top view of reaction band at the wetting tip of eutectic SnPb/Cu reflowed at 200 °C (magnification of (a),(b), and (c) 2000x): (a) 30 s; (b) 1 min; (c) 5 min; and (d) 10 min.

Figure 3 Top view of reaction band at the wetting tip of eutectic SnPb/Cu reflowed at 200 °C (magnification of (a),(b), and (c) 2000x): (a) 30 s; (b) 1 min; (c) 5 min; and (d) 10 min.

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Fig.2 Change of wetting angle with reflov time of three different solders. Fig.4 Width of reaction band at the wetting tip of eutectic SnPb/Cu reflowed at 200 °C.
Fig.2 Change of wetting angle with reflov time of three different solders. Fig.4 Width of reaction band at the wetting tip of eutectic SnPb/Cu reflowed at 200 °C.
Fig.7 SEM images of surface of the eutectic SnPb solder after reflowed: (a) on Pd at 190 °C fo 10 min; (b) on Cu at 200 °C for 10 min.
Fig.7 SEM images of surface of the eutectic SnPb solder after reflowed: (a) on Pd at 190 °C fo 10 min; (b) on Cu at 200 °C for 10 min.
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