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Figure 5: Change from residual tensile to residual compressive stresses with increasing table speed

Figure 5 Change from residual tensile to residual compressive stresses with increasing table speed

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Figure 1: Zones of elastic deformation, plastic deformation and chip formation during grinding [3] Tis POMONA Sinai PrOCesses di©& OMCH Geslisnea to maximize material removal rates or to optimize surface qualities. Therefore, many processes are designed by varying the “resistor” process parameters. One possibility to increase the efficiency of a grinding process is to increase the circumferential speed of the grinding wheel v,. An important advantage of increased productivity due to grinding at high cutting speeds (HSC) is the increased grinding wheel tool life because of decreasing single grain loads [5,6]. The most significant disadvantage of increasing the circumferential speed v, is the rising thermal load acting on the surface layer of the workpiece. Corresponding countermeasures are necessary to avoid a damage of the workpiece, when increasing vs. An appropriate strategy to reduce the thermal load on the workpiece surface layer lies in the increase of the workpiece speed vw (HPC). This way, the single grain load increases slightly, but the process temperature can be lowered significantly. Additionally, the related material removal rate can be increased without damaging the workpiece material. Thus, when varying one of the process parameters, the influence on the thermo-mechanical load acting on the workpiece must be considered. In most cases, this entails the adaptation of at least one other “resistor” such as another process parameter or the specification of the grinding tool. Only with a methodical approach it is possible to extend conventional grinding processes and to achieve reliable HPG nrnacecceac
Figure 1: Zones of elastic deformation, plastic deformation and chip formation during grinding [3] Tis POMONA Sinai PrOCesses di©& OMCH Geslisnea to maximize material removal rates or to optimize surface qualities. Therefore, many processes are designed by varying the “resistor” process parameters. One possibility to increase the efficiency of a grinding process is to increase the circumferential speed of the grinding wheel v,. An important advantage of increased productivity due to grinding at high cutting speeds (HSC) is the increased grinding wheel tool life because of decreasing single grain loads [5,6]. The most significant disadvantage of increasing the circumferential speed v, is the rising thermal load acting on the surface layer of the workpiece. Corresponding countermeasures are necessary to avoid a damage of the workpiece, when increasing vs. An appropriate strategy to reduce the thermal load on the workpiece surface layer lies in the increase of the workpiece speed vw (HPC). This way, the single grain load increases slightly, but the process temperature can be lowered significantly. Additionally, the related material removal rate can be increased without damaging the workpiece material. Thus, when varying one of the process parameters, the influence on the thermo-mechanical load acting on the workpiece must be considered. In most cases, this entails the adaptation of at least one other “resistor” such as another process parameter or the specification of the grinding tool. Only with a methodical approach it is possible to extend conventional grinding processes and to achieve reliable HPG nrnacecceac
Figure 2: Performance characteristics of High Performance Grinding processes According to this characterization, first HPG processes are defined by a significant raise of productivity which means an increased material removal rate or an improved flexibility. Furthermore, operations to achieve outstanding surface qualities can be defined as High Performance Grinding processes. Even the feasibility of machining novel or difficult- to-machine materials is a High Performance Grinding process because the underlying process knowledge can be a competitive advantage for the manufacturer. [1]
Figure 2: Performance characteristics of High Performance Grinding processes According to this characterization, first HPG processes are defined by a significant raise of productivity which means an increased material removal rate or an improved flexibility. Furthermore, operations to achieve outstanding surface qualities can be defined as High Performance Grinding processes. Even the feasibility of machining novel or difficult- to-machine materials is a High Performance Grinding process because the underlying process knowledge can be a competitive advantage for the manufacturer. [1]
Figure 3: Example for an effective process optimization by reduction of the grinding wheel weight their tools and develop grinding tools for specific requirements. Regardless of the quality of a grinding wheel, it only performs optimally if the relationship between the grinding wheel topography and the grinding results is known and the process parameters are adapted accordingly.
Figure 3: Example for an effective process optimization by reduction of the grinding wheel weight their tools and develop grinding tools for specific requirements. Regardless of the quality of a grinding wheel, it only performs optimally if the relationship between the grinding wheel topography and the grinding results is known and the process parameters are adapted accordingly.
Figure 4: Detailed analysis of the grinding wheel topography with the number of kinematic cutting edges (I) and specific cutting edge areas in normal direction A,; and tangential direction A, (ID
Figure 4: Detailed analysis of the grinding wheel topography with the number of kinematic cutting edges (I) and specific cutting edge areas in normal direction A,; and tangential direction A, (ID
Figure 6: Austenite temperatures in dependency of the plastic strain during grinding 100Cr6 steel
Figure 6: Austenite temperatures in dependency of the plastic strain during grinding 100Cr6 steel
Figure 7: PCD surface layer after laser machining and after grinding Grinding processes providing an extremely high surface finish quality can be regarded as High Performance Grinding processes, too. Extraordinary finishing results can be achieved, using precise process control and a special tool design.
Figure 7: PCD surface layer after laser machining and after grinding Grinding processes providing an extremely high surface finish quality can be regarded as High Performance Grinding processes, too. Extraordinary finishing results can be achieved, using precise process control and a special tool design.
the crystal, in detail on the relative position between the cutting direction and the main axis of the crystal. Based on the results a three-zone model of the defected structure of rotational ground wafers was derived. In addition, a direction dependence of the process forces was determined. Concurrent with the SSD investigations, areas with high and low process forces coincide well with the areas of high and low SSD depth, respectively. By means of an innovative temperature measuring concept, which enables the determination of the temperatures in the contact zone during rotational grinding, Pahler found out that within the contact zone slight temperature differences can be resolved [19]. Such improved process insights open up new possibilities of improving the grinding procedure. They offer opportunities to achieve specific sub-surface properties of the ground wafers in combination with improved grinding wheel lifetime. Figure 8: Surface roughness distribution on a 200 mm fine ground (100) oriented Si wafer References
the crystal, in detail on the relative position between the cutting direction and the main axis of the crystal. Based on the results a three-zone model of the defected structure of rotational ground wafers was derived. In addition, a direction dependence of the process forces was determined. Concurrent with the SSD investigations, areas with high and low process forces coincide well with the areas of high and low SSD depth, respectively. By means of an innovative temperature measuring concept, which enables the determination of the temperatures in the contact zone during rotational grinding, Pahler found out that within the contact zone slight temperature differences can be resolved [19]. Such improved process insights open up new possibilities of improving the grinding procedure. They offer opportunities to achieve specific sub-surface properties of the ground wafers in combination with improved grinding wheel lifetime. Figure 8: Surface roughness distribution on a 200 mm fine ground (100) oriented Si wafer References
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