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Thermal Measurement and Modeling of Multi-Die Packages

Profile image of Andras PoppeAndras Poppe

2009, IEEE Transactions on Components and Packaging Technologies

https://doi.org/10.1109/TCAPT.2008.2004578
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Abstract

Thermal measurement and modeling of multi-die packages with vertical (stacked) and lateral arrangement became a hot topic recently in different fields like RAM chip packaging or LEDs and LED assemblies. In our present study we present results for a more complex structure: an opto-coupler device with 4 chips in a combined lateral and vertical arrangement. The paper gives an overview of measurement and modeling techniques and results for stacked and MCM structures. It describes actual measurement results along with our structure function based methodology which helps validating the detailed model of the package being studied. Also, we show how one can derive junction-to-pin thermal resistances with a technique using structure functions.

Figures (14)
Figure 1: Two test dies stacked in a 144 LQFP package.
Figure 1: Two test dies stacked in a 144 LQFP package.
This package (Figure 4) has also been characterized with thermal transient measurements: all elements of its thermal impedance matrix have been measured, both in a still-air and in a cold-plate setup.
This package (Figure 4) has also been characterized with thermal transient measurements: all elements of its thermal impedance matrix have been measured, both in a still-air and in a cold-plate setup.
Figure 5: Comparison of complex loci in still-air setup. Curves 211, Zi2 measured with junction on H1 driven, Z22, Z21 measured with junction on H2 driven. Measuring the package in still-air setup we got the frequency-domain representation of the impedance matrix plotted in Figure 5. Driving the larger chip on the H2 cen- ter tab the self-impedance (Z,7) is lower than when driv- ing the smaller chip (Z;;). Again, the off-diagonal ele- ments show non-reciprocal behavior, Z;> 4 Z>;.
Figure 5: Comparison of complex loci in still-air setup. Curves 211, Zi2 measured with junction on H1 driven, Z22, Z21 measured with junction on H2 driven. Measuring the package in still-air setup we got the frequency-domain representation of the impedance matrix plotted in Figure 5. Driving the larger chip on the H2 cen- ter tab the self-impedance (Z,7) is lower than when driv- ing the smaller chip (Z;;). Again, the off-diagonal ele- ments show non-reciprocal behavior, Z;> 4 Z>;.
Note, that the above impedance matrix reduces to a thermal resistance matrix if the steady-state values of the time-domain impedances (t=0o) or if the 0 Hz value of the frequency-domain impedance values are considered. Such an R,, matrix is presented for multi-die LED assembly in [8] where asymmetry of the off-diagonal elements of the matrix has also been reported. of the 7; temperature responses at all dies.
Note, that the above impedance matrix reduces to a thermal resistance matrix if the steady-state values of the time-domain impedances (t=0o) or if the 0 Hz value of the frequency-domain impedance values are considered. Such an R,, matrix is presented for multi-die LED assembly in [8] where asymmetry of the off-diagonal elements of the matrix has also been reported. of the 7; temperature responses at all dies.
veloping general models. In one approach to modeling multi die packages, the matrix representation of the pack- age is used with the aim of developing compact models which also exhibit the reported non-reciprocal behavior. Such a model is shown in Figure 6.
veloping general models. In one approach to modeling multi die packages, the matrix representation of the pack- age is used with the aim of developing compact models which also exhibit the reported non-reciprocal behavior. Such a model is shown in Figure 6.
Figure 8: Suggested flow of validation of detailed models with the help of structure functions.
Figure 8: Suggested flow of validation of detailed models with the help of structure functions.
Figure 9: A dual opto-coupler devices in a plastic DIL package containing four chips: cross-sectional view of the package and 3D axonometric view of the detailed CAD model
Figure 9: A dual opto-coupler devices in a plastic DIL package containing four chips: cross-sectional view of the package and 3D axonometric view of the detailed CAD model
Figure 10: Measured thermal impedances with detector driven in “low power” samples. Still-air environment, low conductance (LCB) and high conductance (HCB) board.
Figure 10: Measured thermal impedances with detector driven in “low power” samples. Still-air environment, low conductance (LCB) and high conductance (HCB) board.
JEDEC type steady-state thermal metrics have been iden- tified both from the physical test results and from simulation of the validated detailed models. The juncti the on- to-ambient thermal resistance values are read directly from the structure functions: the location of the singu ity provides the Ry, value for any test environment. ar- For the identification of junction-to-case thermal resistance values the so-called dual interface method was used Here two measurements were carried out; one with “case” surface of the package in a direct contact wit [6]. the ha cold plate and a second with a thermal insulator layer inserted between the package and the cold plate. resulting structure functions are shown in Figure 12. The
JEDEC type steady-state thermal metrics have been iden- tified both from the physical test results and from simulation of the validated detailed models. The juncti the on- to-ambient thermal resistance values are read directly from the structure functions: the location of the singu ity provides the Ry, value for any test environment. ar- For the identification of junction-to-case thermal resistance values the so-called dual interface method was used Here two measurements were carried out; one with “case” surface of the package in a direct contact wit [6]. the ha cold plate and a second with a thermal insulator layer inserted between the package and the cold plate. resulting structure functions are shown in Figure 12. The

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