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Outline

Finite Element Analysis of Microchip Cooling

2004

Abstract

As electronic components continue to decrease in size and increase in power, thermal management becomes more important. Devices such as heat sinks and fans can help alleviate thermal problems, but add cost and manufactUling complexity to devices. More intimate knowledge of how a component behaves can allow companies to better determine the viability of a design and reduce over building.

References (5)

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