Evolution of Reliability Assessment In PCB Assemblies

Transactions of The Institute of Measurement and Control, 2009

This paper presents a physics-of-failure (PoF)-based prognostics and health management approach for effective reliability prediction. PoF is an approach that utilizes knowledge of a product's life cycle loading and failure mechanisms to perform reliability design and assessment. PoF-based prognostics permit the assessment of product reliability under its actual application conditions. It integrates sensor data with models that enable in situ assessment of the deviation or degradation of a product from an expected normal operating condition (ie, the product's 'health') and the prediction of the future state of reliability. A formal implementation procedure, which includes failure modes, mechanisms, and effects analysis, data reduction and feature extraction from the life cycle loads, damage accumulation, and assessment of uncertainty, is presented. Then, applications of PoF-based prognostics are discussed.

IEEE Access

To meet the specifications of low cost, highly reliable electronic devices, fault diagnosis techniques play an essential role. It is vital to find flaws at an early stage in design, components, material, or manufacturing during the initial phase. This review paper attempts to summarize past development and recent advances in the areas about green manufacturing, maintenance, remaining useful life (RUL) prediction, and like. The current state of the art in reliability research for electronic components, mainly includes failure mechanisms, condition monitoring, and residual lifetime evaluation is explored. A critical analysis of reliability studies to identify their relative merits and usefulness of the outcome of these studies' visa -vis green manufacturing is presented. The wide array of statistical, empirical, and intelligent tools and techniques used in the literature are then identified and mapped. Finally, the findings are summarized, and the central research gap is highlighted. INDEX TERMS Reliability methods; condition monitoring; faults and failures; prognostics and diagnostics I. INTRODUCTION

IEEE Transactions on Components and Packaging Technologies, 2000

In this paper, a methodology for prognostication-ofelectronics has been developed for accurate assessment of residual life in a deployed electronic components, and determination of damage-state in absence of macro-indicators of failure. Proxies for leading indicators-of-failure have been identified and correlated with damage progression under thermomechanical loads. Examples of proxies include -microstructural evolution characterized by average phase size and intermetallic growth rate in solder interconnects. Validity of damage proxies has been investigated for both 63Sn37Pb leaded and SnAgCu leadfree electronics. Structures examined includeplastic ball grid array format electronic and MEMS Packages and discrete devices assembled with FR4-06 laminates. Focus of the research presented in this paper is on interrogation of the aged material's damage state and enhancing the understanding of damage progression. The research is aimed at development of damage relationships for determination of residual life of aged electronics and assessment of design margins instead of life prediction of new components. The prognostic indicators presented in this paper, can be used for health monitoring of electronic assemblies.

Australian Journal of Basicand Applied Sciences, 2009

Reliability is one of the main salient assets of modern electronic systems and its improvement is of utmost importance in manufacturingof high-reliability electronic products. The only possible means of improving the operational characteristics of electronic systems and reducing their overall lifecycle costs is improving their reliability. This is possible through designing in reliability at the design and verification stage, and planning a thorough testing program to achieve maximum reliability at minimum costs. Highly accelerated life testing in the initial stages of development and environmental stress screening programs for the later stages of product manufacturing and testing are practical tools in the hands of reliability engineers to achieve this goal. In this paper, the effectiveness of screening programs is analyzed based on which optimum highly accelerated life testing procedures for discovering flaws in design and manufacturing early in the products design and manufacturing are carried out, and environmental stress screening procedures for the testing of manufactured products are planned and implemented for high reliability electronic products. Results of actual HALT and ESS testing are presented.

Applied Sciences, 2021

This paper presents the use of physics of failure (PoF) methodology to infer fast and accurate lifetime predictions for power electronics at the printed circuit board (PCB) level in early design stages. It is shown that the ability to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies allows, for instance, the prediction of solder fatigue failure due to thermal, mechanical, and manufacturing conditions. The technique allows a life-cycle prognosis of the PCB, taking into account the environmental stresses it will encounter during the period of operation. Primarily, it involves converting an electronic computer aided design (eCAD) circuit layout into computational fluid dynamic (CFD) and finite element analysis (FEA) models with accurate geometries. From this, stressors, such as thermal cycling, mechanical shock, natural frequency, and harmonic and random vibrations, are applied to understand PCB degradation, and semiconductor...

IEEE Transactions on Components and Packaging Technologies, 2000

The current state of the art in managing system reliability is geared toward the development of predictive models for unaged pristine materials. The current state of art allows the prediction of time-to-failure for a pristine material under known loading conditions based on relationships such as the Paris' power law [16], [17], the Coffin-Manson relationship [2], [13], [23], [24]

SAE Technical Paper Series, 2015

There is a concern that the continuing trend on miniaturization (Moore's law) in IC design and fabrication might have a negative impact on the device reliability. To understand and to possibly quantify the physics underlying this concern and phenomenon, it is natural to proceed from the experimental bathtub curve (BTC)-UHOLDELOLW\ ³SDVVSRUW´ RI WKH GHYLFH 7KLV FXUYH UHÀHFWV WKH FRPELQHG effect of two major irreversible governing processes: statistics-related mass-production process that results in a decreasing failure rate with time, and reliability-physics-related degradation (aging) process that leads to an increasing failure rate. It is the latter process that is of major concern of a device designer and manufacturer. The statistical process can be evaluated theoretically, using a rather simple predictive model. Owing to that and assuming that the two processes of interest are statistically independent one can assess the failure rates associated with the aging process from the BTC data by simply subtracting the predicted ordinates of the statistical failure rates (SFR) from the BTC ordinates. The objective of this analysis is to show how this could be done. The suggested methodology proceeds from the concepts that the actual ("instantaneous") SFR is a random variable with a known (assumed, established) probability distribution, that the experimental BTC can be represented by its infant mortality and the wear-out portions only (the steady-state portion in this case is simply the boundary between the infant mortality and wear-out portions) and that the two BTC portions considered can be approximated analytically. The cases, when the "instantaneous" SFR is distributed normally and in accordance with the Rayleigh law are used as suitable illustrations of the general concept. The developed methodology can be employed when there is a need to better understand the relative roles of the statistics-related and physics-of-failure-related processes in reliability evaluations of electronic products. The methodology can be used also beyond the ¿HOG RI ,& HQJLQHHULQJ ZKHQ WKHUH LV D QHHG WR XQGHUVWDQG DQG hence, to separate the roles of the two irreversible processes in question. One of the major challenges of the future work is to determine the probability distributions of the actual ("instantaneous") SFRs for particular products and applications.

ASME 2009 InterPACK Conference, Volume 1, 2009

Electronic assemblies deployed in harsh environments may be subjected to multiple thermal environments during the use-life of the equipment. Often the equipment may not have any macro-indicators of damage such as cracks or delamination. Quantification of thermal environments during use-life is often not feasible because of the data-capture and storage requirements, and the overhead on core-system functionality. There is need for tools and techniques to quantify damage in deployed systems in absence of macro-indicators of damage without knowledge of prior stress history. The presented PHM framework is targeted towards high reliability applications such as avionic and space systems. In this paper, Sn3.0Ag0.5Cu alloy packages have been subjected to multiple thermal cycling environments including -55 to 125C and 0 to 100C. Assemblies investigated include area-array packages soldered on FR4 printed circuit cards. The methodology involves the use of condition monitoring devices, for gathering data on damage pre-cursors at periodic intervals.

2008 International Conference on Prognostics and Health Management, 2008

Aerospace-electronic systems usually face a very harsh environment, requiring them to survive the high strain rates, e.g. during launch and re-entry and thermal environments including extreme low and high temperatures. Traditional health monitoring methodologies have relied on reactive methods of failure detection often providing little or no insight into the remaining useful life of the system. In this paper, a mathematical approach for interrogation of system state under cyclic thermomechanical stresses has been developed for 6-different leadfree solder alloy systems. Data has been collected for leading indicators of failure for alloy systems including, Sn3Ag0.5Cu, Sn3Ag0.7Cu, Sn1Ag0.5Cu, Sn0.3Ag0.5Cu0.1Bi, Sn0.2Ag0.5Cu0.1Bi0.1Ni, 96.5Sn3.5Ag second-level interconnects under the application of cyclic thermo-mechanical loads. Methodology presented resides in the pre-failure space of the system in which no macro-indicators such as cracks or delamination exist. Systems subjected to thermo-mechanical damage have been interrogated for system state and the computed damage state correlated with known imposed damage. The approach involves the use of condition monitoring devices which can be interrogated for damage proxies at finite timeintervals. Interrogation techniques are based on derivation of damage proxies, and system prior damage based non-linear leastsquares methods including the Levenberg-Marquardt Algorithm. The system's residual life is computed based on residual-life computation algorithms.

Journal of Konbin, 2008

Aging Processes as a Primary Aspect of Predicting Reliability and Life of Aeronautical Hardware The forecasting of reliability and life of aeronautical hardware requires recognition of many and various destructive processes that deteriorate the health/maintenance status thereof. The aging of technical components of aircraft as an armament system proves of outstanding significance to reliability and safety of the whole system. The aging process is usually induced by many and various factors, just to mention mechanical, biological, climatic, or chemical ones. The aging is an irreversible process and considerably affects (i.e. Reduces) reliability and life of aeronautical equipment.