Wafer-scale packaging for FBAR-based oscillators
2011, 2011 Joint Conference of the IEEE International Frequency Control and the European Frequency and Time Forum (FCS) Proceedings
https://doi.org/10.1109/FCS.2011.5977848Abstract
Recent advances in temperature-compensation for FBAR (Film Bulk Acoustic Resonators) have brought this technology forward as a serious contender in the oscillator marketplace. As with any mechanical resonator oscillator, a cost-effective hermetic package combined with circuit technology are critical for commercial application. Billions of FBAR duplexers have been fabricated using Avago Technologies' wafer-scale packaging process, whereby a silicon lid wafer is Au-diffusion-bonded to a base FBAR wafer to make a robust, hermetic package. This paper presents a method for integrating circuitry into the lid wafer to form a sub-0.1 mm 3 , sub mW, 1.5 GHz temperature-compensated chip-scale oscillator. Circuit integration, testing and performance will be discussed. I.
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