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Outline

Solution-processed image sensors on flexible substrates

2016, Flexible and Printed Electronics

https://doi.org/10.1088/2058-8585/1/4/043001

Abstract

Copper(I) thiocyanate (CuSCN) as a hole-transport material for large-area opto/electronics

Key takeaways
sparkles

AI

  1. Solution-processed image sensors utilize flexible substrates, enhancing scalability and reducing costs compared to silicon.
  2. Active-switching architectures improve signal-to-noise ratio (SNR) by enabling intra-pixel charge integration.
  3. Large pixel areas are crucial for performance, particularly at higher frame rates and shorter integration times.
  4. Figures of merit like external quantum efficiency (EQE) and specific detectivity (D*) assess photodiode performance.
  5. Dynamic range is determined by the photogenerated signal's limits, influenced by noise and saturation factors.

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