Solution-processed image sensors on flexible substrates
2016, Flexible and Printed Electronics
https://doi.org/10.1088/2058-8585/1/4/043001Abstract
Copper(I) thiocyanate (CuSCN) as a hole-transport material for large-area opto/electronics
Key takeaways
AI
AI
- Solution-processed image sensors utilize flexible substrates, enhancing scalability and reducing costs compared to silicon.
- Active-switching architectures improve signal-to-noise ratio (SNR) by enabling intra-pixel charge integration.
- Large pixel areas are crucial for performance, particularly at higher frame rates and shorter integration times.
- Figures of merit like external quantum efficiency (EQE) and specific detectivity (D*) assess photodiode performance.
- Dynamic range is determined by the photogenerated signal's limits, influenced by noise and saturation factors.
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