Papers by Zakaria EL HADDAD
Nowadays, microelectronics plays a key role in our daily lives, such as communication, transporta... more Nowadays, microelectronics plays a key role in our daily lives, such as communication, transportation, embedded systems, medicine etc, so we need to make sure that we can rely on microelectronics systems, while considering the thermal and vibratory fatigue, to make sure of that a lot of methods and simulation were introduced into the process of manufacturing. The reliability and fatigue life prediction of a system is an important problem in product design field, These problems are caused by the fatal flaw of the microelectronic packaging which contain solder joints, their reliability has a great impact on the reliability of the entire packaging structure. The cause of the fatigue failure of solder joints is usually caused by the accumulation of thermo-mechanical damages due to the operating conditions of thermal and mechanical shock. To predict the fatigue life of solder joints in ball grid array (BGA) packaging, finite element analysis methods are mostly used but this tool is not e...
Nowadays electronics play a crucial role in several applications: medicine, embedded systems of t... more Nowadays electronics play a crucial role in several applications: medicine, embedded systems of transportation and telecommunication. While achieving electrical functions, electronic systems must be safe, reliable, have low thermal resistance (To dissipate the heat properly) and must be durable and insensitive to the exterior environment variations (Humidity, thermal and mechanical shock ...) In this study a threedimensional finite element simulation using ANSYS 15.0.7 APDL on solder joint in a Ball Grid Array (BGA) under Mechanical cycling bending test was executed to predict the fatigue life of solder joint. To predict the latter, we divide our simulation analysis into e three parts as follows: First: three-dimensional finite element analysis for calculating the stiffness assembly and imposed strain values. Second: one dimensional conjoint creep and time independent plastic deformation analysis under mechanical cyclic bending loading for calculating the inelastic strain energy. An...
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Papers by Zakaria EL HADDAD