Papers by Ananda De Silva
With widespread use of smartphones, many people use smartphone online shopping applications to en... more With widespread use of smartphones, many people use smartphone online shopping applications to enjoy online purchasing. However, Japanese young people’s behavior and perceptions with regard to smartphone online shopping applications are unclear. To reveal these perceptions and priorities, this study examined Japanese respondents’ adoption of online shopping applications on smartphones by applying a choice-based conjoint analysis. This study revealed that our respondents place the highest priority on the security considerations of online shopping applications. Popularity is another important attribute of online shopping applications. Gender, living area, and users’ online purchase experience affect young people’s priorities for smartphone online purchasing.
A variety of Pb-free solders and under bump metallurgies (UBMs) was investigated for flip chip pa... more A variety of Pb-free solders and under bump metallurgies (UBMs) was investigated for flip chip packaging applications. The result shows that the Sn-0.7Cu eutectic alloy has the best fatigue life and it possess the most desirable failure mechanism in both thermal and isothermal mechanical tests regardless of UBM type. Although the electroless NiP UBM has a much slower reaction rate with solders than the Cu UBM, room temperature mechanical fatigue is worse than on the Cu UBM when coupled with either Sn-3.8Ag-0.7Cu or Sn-3.5Ag solder. The Sn-37Pb solder consumes less Cu UBM than all other Pb-free solders during reflow. However, Sn-37Pb consumes more Cu after solid state annealing. Studies on aging, tensile, and shear mechanical properties show that the Sn-0.7Cu alloy is the most favorable Pb-free solder for flip chip applications.
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Papers by Ananda De Silva