Selon un aspect, la presente invention concerne un substrat de cuivre; un catalyseur sur la surfa... more Selon un aspect, la presente invention concerne un substrat de cuivre; un catalyseur sur la surface du substrat de cuivre; un materiau d'interface thermique comportant une couche contenant des nanotubes de carbone en contact avec le catalyseur. Les nanotubes de carbone sont orientes sensiblement perpendiculaires a la surface du substrat de cuivre. Un spectre Raman de la couche contenant des nanotubes de carbone presente une crete D a ∼1350 cm-1 avec une intensite ID, une crete G a∼1585 cm-1 avec une intensite IG, et un rapport d'intensite ID / IG inferieur a 0,7 a une longueur d'onde d'excitation laser de 514 nm. Le materiau d'interface thermique presente une resistance thermique massique, une resistance de contact au niveau d'une interface entre le materiau d'interface thermique et le substrat de cuivre, et une resistance de contact au niveau d'une interface entre le materiau d'interface thermique et un dispositif a semi-conducteurs. Une sommatio...
Method and system for creating and verifying structural logic model of electronic design from behavioral description, including generation of logic and timing models
Method and system for creating and validating low level description of electronic design from higher level, behavior-oriented description, including estimation and comparison of low-level design constraints
Methodology for deriving executable low-level structural descriptions and valid physical implementations of circuits and systems from high-level semantic specifications and descriptions thereof
System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
Discloses the use of a carbon nanotube or nanowire arrays to reduce the radiator structure betwee... more Discloses the use of a carbon nanotube or nanowire arrays to reduce the radiator structure between the integrated circuit chip and the heat sink in thermal contact resistance. Incorporated in the carbon nanotube array with thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface having a high axial and transverse thermal conductivity.
Method and system for creating and validating low level structural description of electronic design from higher level, behavior-oriented description, including estimating power dissipation of physical implementation
Method and System for Creating, Deriving and Validating Structural Description of Electronic System from Higher Level, Behavior-Oriented Description, Including Interactive Schematic Design and Simulation
ECAD system for deriving executable low-level structural descriptions and valid physical implementations of circuits and systems from high-level semantic descriptions thereof
Uploads
Papers by Carlos Dangelo