Effect of Substrate temperature on the microstructure variation in sputter-deposited hydrogenated amorphous silicon thinfilms
International Conference on Advanced Nanomaterials Emerging Engineering Technologies, 2013
ABSTRACT Vacancy, void incorporation and Si-Hx configuration in hydrogenated amorphous silicon (a... more ABSTRACT Vacancy, void incorporation and Si-Hx configuration in hydrogenated amorphous silicon (a-Si:H) thin films was studied. Films were grown by Direct Current (DC), pulsed DC and Radio Frequency (RF) magnetron sputtering. Fourier Transform Infrared (FTIR) spectroscopic analysis has been carried out on the films and found that, the a-Si:H films grown by DC magnetron sputtering are of good quality compared to pulsed DC and RF deposited films. The effect of Substrate temperature (TS) on the total hydrogen concentration (CH), configuration of hydrogen bonding, density (decided by the vacancy and void incorporation) and the microstructure factor (R*) was studied. TS is found to be an active parameter in affecting the above said properties of the films. The films contain both vacancies and voids. At low hydrogen dilutions the films are vacancy dominated and at high hydrogen dilutions they are void dominated. It is found that TS favors monohydride (Si-H) bonding at the cost of dihydride (Si-H2) bonding. This dividing line is at CH=14 at.%H for DC sputter deposited films. The microstructure structure factor R* is found to be zero for as deposited DC films at TS=773K. The threshold CH for void dominated region is found to be CH=23 at.%H for RF, CH=18 at.%H for PDC and CH~14 at.%H for DC sputter deposited films.
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Papers by G. Mohan Rao